Principal Hardware Architect, Embedded Systems – Job Order 3508

Principal Hardware Architect, Embedded Systems – Job Order 3508

Somerville, MA 02145
$145K to $190K
Top Benefits plus 10% 401K contribution
U.S. Citizenship (Clearance Eligible)
Onsite
Relocation assistance is available

Role Overview
A high-impact engineering team in Somerville is seeking a senior-level hardware architect to lead the design and development of embedded electronics for advanced computing, sensing, and actuation systems. This role blends hands-on technical execution with cross-functional collaboration across short- and mid-term R&D programs (typically 12–18 months).

Ideal candidates are self-directed engineers with deep experience in digital hardware design, embedded platforms, and system integration. You’ll contribute to both sponsored and internal innovation efforts, helping shape next-gen solutions in a fast-paced, multidisciplinary environment.

Key Responsibilities
– Architect and implement hardware systems from concept through delivery
– Design, prototype, and validate complex electronic assemblies
– Solve technical challenges with minimal oversight and high autonomy
– Document designs for manufacturing and long-term support
– Collaborate across engineering disciplines to ensure system-level success
– Mentor junior engineers and contribute to team development
– Support proposal writing and business development initiatives

Required Qualifications
– Bachelor’s degree in Electrical Engineering or related field (Master’s preferred)
– 5–10 years of experience in electronic hardware design
– Strong communication, documentation, and time management skills
– U.S. citizenship required for security clearance eligibility

Technical Skills & Experience
– PCB design including digital logic, sensor interfaces, and power distribution
– Familiarity with FPGAs, SoCs, and embedded processors
– Power integrity and conditioning for digital systems
– High-speed interfaces: DDR3/4, PCIe, gigabit serial links
– Embedded software/firmware understanding (C/C++, VHDL/Verilog)
– Tools: Siemens Designer/Layout, HyperLynx, Ansys, SPICE, MATLAB
– Experience with compact packaging (bare die, chip-scale integration)