Semiconductor Process Integration & Fabrication Engineer – Job Order 3546

Semiconductor Process Integration & Fabrication Engineer – Job Order 3546

• Full-time position
• Hybrid work schedule with regular onsite presence required
• Base salary range: $155,000 – $192,000, depending on experience and qualifications

Position Overview

We are seeking a Semiconductor Process Integration & Fabrication Engineer to support advanced microelectronics prototyping programs from initial technical review through fabrication, metrology, packaging coordination, and transition to production or follow-on engineering activity.

This role is well suited for an engineer with hands-on experience in semiconductor fabrication who can work across internal technical teams, external fabrication partners, packaging providers, and customers to turn process concepts into working hardware. The position requires strong process fundamentals, practical fab experience, and the ability to coordinate complex technical activities across multiple organizations.

Key Responsibilities

• Support advanced semiconductor prototyping projects from technical intake through fabrication, metrology, packaging coordination, and handoff to production or next-stage engineering.
• Translate customer or program requirements into executable fabrication process plans.
• Assist with technical feasibility assessments, process-flow development, and risk identification.
• Serve as a technical interface between internal engineering teams, external fabrication facilities, university research labs, and industry partners.
• Participate in recurring technical reviews, project updates, and process-readiness discussions.
• Support process development, recipe documentation, troubleshooting, and yield-improvement activities in microfabrication or nanofabrication environments.
• Coordinate wafer-to-package transitions, including communication with packaging, assembly, and test partners.
• Assist with process transfer, partner capability assessments, and readiness reviews across multiple fabrication environments.
• Contribute to data-driven process optimization efforts, including statistical process control, yield analysis, defect analysis, or manufacturing analytics.
• Maintain accurate documentation of process flows, metrology results, experiment outcomes, partner capabilities, and technical decisions.

Required Qualifications

• Bachelor’s degree in Electrical Engineering, Materials Science, Physics, Microelectronics, or a related technical discipline with 5+ years of industrial semiconductor fabrication experience;
  or
• Master’s degree in a related field with 2+ years of industrial semiconductor fabrication experience;
  or
• PhD in a related field with 0–5 years of post-degree experience.
• Hands-on experience in microfabrication or nanofabrication processes such as:
  • Lithography
  • Thin-film deposition
  • Etch
  • Metrology
  • Process characterization
• Working knowledge of semiconductor device physics and fabrication fundamentals.
• Experience supporting process development, troubleshooting, process improvement, or yield-enhancement efforts in a fabrication facility.
• Ability to work with cross-functional technical teams and external partners.
• Strong written and verbal communication skills.
• Must qualify as a U.S. Person, defined as a U.S. citizen or lawful permanent resident.

Preferred Qualifications

• Experience with semiconductor process integration, process transfer, or technology readiness activities.
• Exposure to advanced semiconductor packaging or wafer-to-package transitions, including one or more of the following:
  • Wafer-level packaging
  • Flip-chip assembly
  • 2.5D or 3D integration
  • TSV
  • Fan-out packaging
  • Redistribution layers
  • Heterogeneous integration
• Familiarity with data analytics or AI/ML-enabled approaches in semiconductor manufacturing, such as:
  • Statistical process control
  • Yield analysis
  • Defect analytics
  • Manufacturing data analysis
• Experience working in collaborative R&D environments involving academic, government, commercial, or multi-partner technical programs.
• Familiarity with compound semiconductors such as GaN, InP, or GaAs.
• Experience with silicon-based process integration.
• Familiarity with semiconductor test equipment, CAD tools, process documentation tools, and standard engineering software.

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